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Trim and form recommendations
Lead trim & form operations are often applied on SIP packaged Hall sensor ICs during system assembly, in order to position the sensor exactly at operating position and shape the leads to secure electrical contacts by soldering on PCB or welding.
Significant forces are applied during trim and form operations. Without appropriate precautions applied force may act as a stress factor to the plastic body of the sensor or to the leads relative to the plastic body. Such stress may cause a device malfunction, key parameter drift or introduce a reliability risk (latent defect).
This document contains recommendations for Lead trimming and forming.
Current Revision:
3.11
File Type:
Application Note
File Size:
127.1 KB
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