Analysis Capability
Melexis operates with sophisticated tools, inclusive Know How and highly qualified personnel for the enlightenment of root causes of failures in digital and mixed signal LSI- integrated circuits and micro sensors coming from:
 IC design (first silicon debugging)
Quality- and Reliability tests
ESD- and EMC tests
Failures in field applications
In addition to classical electrical characterization methods there are following analysis methods in use:
Scanning Acoustic Microscopy (SAM)
Focused Ion Beam (FIB)
Laser Scanning Microscopy (LSM)
Lock-In-Thermography (LIT)
Emission Microscopy (EMI)
Scanning Electron Microscopy (SEM)
Microprobing
Electron Beam Microprobing (EBEAM)
Transmission Electron Microscopy (TEM)
Chemical Deprocessing
Cross- Section
X-ray
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