Discover Melexis’ Time-of-Flight chipset in tofmotion’s industrial 3D cam

Real-Time 3D Imaging QVGA Time-of-Flight Chipset - Melexis

Tessenderlo, Belgium, 20 November 2017 - Melexis’ partner tofmotion, specialized in creating overall solution packages in depth sensing and imaging will showcase their TFM 3D cameras at sps ipc drives. The TFM IC5 cam, based on the Melexis’ Time-of-Flight chipset, enables fastest 3D imaging at full QVGA resolution. The camera is rugged and certified for industrial and outdoor environment and it can record depth data maps up to 160 frames per second and are able to process all images at the onboard processor immediately. Object detection and classification targeted to your application minimizes data transfer and allows direct connection to automation and control, as well as to robotics (ROS). The TFM IC5 cam can be used as a ready-to-use camera for evaluation purposes.


Tofmotions services consist of feasibility studies, prototyping based on Melexis’ evaluation kit and organizing a ToF training center. Experience Melexis’ products in action at tofmotion’s booth at sps ipc drives from 28 to 30 November 2017: booth 450, hall 3A.

 

Inspired Engineering

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