Automotive Gen 2 QVGA Time-of-Flight (ToF) sensor IC

The high dynamic range DepthSense™ ToF pixel array has enhanced sensitivity and a new selectable gain feature allows designers to find the optimum trade-off between illumination power, accuracy and ambient light robustness.

The MLX75024 supports both 850 nm and 940 nm wavelengths. The sensor has a built-in temperature sensor and supports test patterns for system diagnostics. The MLX75024 is available in the same automotive proven package technology as MLX75023, a chip scale glass ball grid array (BGA) package and offers many integration possibilities.

The MLX75024 has been designed to work with the MLX75123BA companion chip.

Melexis' time-of-flight sensors enable robust 3D imaging solutions and large scalability of resolution, range, and field-of-view. Our MLX75024 engineering samples and reference application schematic are available on request.