Gen2 QVGA time-of-flight
MLX75024 Melexis
The high dynamic range DepthSense™ ToF pixel array has enhanced sensitivity and a new selectable gain feature allows designers to find the optimum trade-off between illumination power, accuracy and ambient light robustness.
Top features
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Supports both 850 nm and 940 nm wavelength
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Frame to frame selectable pixel gain
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Integrated temperature sensor
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Sensor readout up to 80 Mpx/s
- Test row and columns for diagnostics
Product description
The high dynamic range DepthSense™ ToF pixel array has enhanced sensitivity and a new selectable gain feature allows designers to find the optimum trade-off between illumination power, accuracy and ambient light robustness.
The MLX75024 supports both 850 nm and 940 nm wavelengths. The sensor has a built-in temperature sensor and supports test patterns for system diagnostics. The MLX75024 is available in the same automotive proven package technology as MLX75023, a chip scale glass ball grid array (BGA) package and offers many integration possibilities.
The MLX75024 has been designed to work with the MLX75123BA companion chip.
Melexis' time-of-flight sensors enable robust 3D imaging solutions and large scalability of resolution, range, and field-of-view. Our MLX75024 engineering samples and reference application schematic are available on request.
Features and benefits
-
Supports both 850 nm and 940 nm wavelength
-
Frame to frame selectable pixel gain
-
Integrated temperature sensor
-
Sensor readout up to 80 Mpx/s
- Test row and columns for diagnostics
