Melexis to present inspired automotive engineering at CAR ELE 2018 in Japan
Booth will feature multiple active technology demonstrations to inspire visitors.
Tessenderlo, Belgium - 15 January 2018 - Melexis will once again be exhibiting at CAR ELE (Tokyo, 17th – 19th January, Booth E46-40). This pivotal event is now in its 10th year and is recognized as essential to supporting technology progression within the automotive industry. Melexis’ booth will feature a number of demonstrations, showcasing their latest innovations in the automotive sphere.
Combining Melexis’ thermal infrared sensor arrays and Time of Flight (ToF) cameras, the ‘Cube’ demo showcases Melexis’ ToF semiconductor technology. This solution is optimized for applications where extended temperature range and ambient light robustness are crucial, like in automotive applications. The demo captures a QVGA 3D image of people showing their position and posture with LEDs and indicating temperature through color – ideal for HMI and in-cabin monitoring.
The LIN RGB demo showcases advances in the personalization of in-cabin lighting. A 16-bit microcontroller enables the precise control of multiple LEDs via the LIN bus, mixing and calibrating for accurate color. The sophisticated solution compensates for temperature changes and changes in LED output characteristics over time.
Intended for occupancy detection and in-cabin climate monitoring, the MLX90640 will be demonstrated. This is a 32 x 24 pixel resolution infrared (IR) sensor array that can deliver industry-leading noise performance, high temperature accuracy and rapid responsiveness. The demonstration will show how signal-enhanced thermopile technology delivers a compact and financially attractive alternative to high-end thermal cameras.
Alongside these flagship demos, Melexis will host active demonstrations of other innovative technologies including magnetic programmable latch & switch with uPower and ASIL B capability and their patented Triaxis® position sensing technology for rotary knobs, joysticks and much more.
Commenting on the show attendance Daniel Tefera, Senior Field Applications Engineer for Japan Melexis said: “We are very excited to be attending CAR ELE once again. This show is one of the most important on the automotive calendar and, following a busy year of R&D, we have some exciting advances to show the visitors. We look forward to seeing existing customers again and meeting some new ones.”
CAR-ELE, Asia’s leading exhibition specialized in Automotive Electronics, will take place from 17 until 19 January 2018 in the Tokyo Big Sight venue in Japan. Melexis will be on booth E46-40, where their experienced engineering staff will be available to discuss all aspects of Melexis products and how they may best be used in your applications.
For more information about the show, visit the official website.