Soldering and welding
Soldering refers to a set of processes for electrically connecting the IC leads to the PCB terminals.
Soldering for Surface Mount Technology (SMT)
The following guidelines cover reflow soldering, which is the only applicable method for Melexis SMD components.
Soldering of Through Hole Devices (THD)
This Application Note only addresses some specific points and best practices during soldering of Melexis THD.
Soldering techniques for TO39 IR sensor product
The following guidelines cover wave soldering, pin‐through‐paste for reflow soldering and manual/robotic iron soldering, which are applicable methods for Melexis TO39 IR components.
Welding of PCB-less devices
Welding is a process of electrically connecting the core material of IC (Integrated Circuit) leads to the customer housing terminals without an extra connecting alloy (solder). Both Electric Resistance Welding (ERW) and Laser Welding (LW) are possible on PCB-less devices leads. Usually the housing terminals are of similar metal alloy as the IC leads. Welding to dissimilar metal alloys is also possible (i.e. steel) but requires more attention in parameters settings and control. The welding joint should be strong enough to survive thermal elongation stress – the value of this stress depends on the construction dimensions and overall length of welded IC and terminal. Maximum stress value is usually by thermomechanical simulation of IC integrated into the module. It should also withstand fatigue stress caused by thermal excursions and vibrations.
Download guidelines for welding of PCB-less devices (PDF - 230 KB)