Storage, handling and shelf life
Storage and handling of plastic encapsulated ICs
After plastic assembly of a plastic encapsulated device, exposure to the environment might degrade the materials of the package. The following guidelines details proper storage and handling conditions to mitigate the problems associated with degradation mechanisms
Shelf life confirmation letter
Non-hermetic (valid for plastic encapsulated electronic) electronic packaged devices require appropriate handling to ensure optimum board performances.
See also Melexis' Soldering Recommendations.
To ensure optimum board performances, moisture loading and shelf life are important parameters.
Download shelf life confirmation letter (PDF - 233 KB)