Frequently Asked Environmental Questions (FAQ)

What is RoHS?

RoHS stands for Restriction of use of Hazardous Substances. RoHS is a directive issued June 8, 2011 by the European Commission (EC).

The RoHS directive requires that certain hazardous substances are removed from all electrical and electronic equipment. The substances may be present incidentally at certain levels as long as they are declared. The certain substances are Cadmium (Cd), hexavalent Chromium (CR VI), Lead (Pb), Mercury (Hg), polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE), Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP).

Is a lead-free product RoHS compliant?

Yes, Melexis' integrated circuits (ICs), which are lead-free, are RoHS compliant and meet the regulatory thresholds for cadmium, hexavalent chromium, lead, mercury, polybrominated biphenyls (PBBs), polybrominated diphenyl ethers (PBDEs), Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP).

What is the material that is used in the lead-free plating?

Melexis is using Matte Pure Tin (pure Sn) to replace the tin lead (SnPb) plating. Matte Tin is being adopted by the majority of electronic component manufacturers. It is proven to be compatible with the different available lead-free solder processes and is forward and backward compatible.

How will lead-free and/or green part be distinguished from earlier lead bearing versions?

Melexis is maintaining traceability through its lot and date code information branded on the IC’s. No special or specific marking will be added as all products are already marked by date code and the conversion process is occurring at a given moment in time. Packing and shipping containers will be clearly marked as lead-free/RoHS compliant products.

Is a Pb containing component compatible with a lead-free process? Is a lead-free component compatible with SnPb process?

See compatibility table below:

 Lead Finish  Reflow Process and Peak Temperature Range
 Tin/Lead Process
(220°C - 235°C)
 Lead-Free Process
(240°C - 260°C)
 Tin/Lead (SnPb)  OK  OK if device is qualified for 
260°C (forward compatible)
Lead-Free (matte Sn)  OK (backward compatible)  OK 

       

Is packaging material free of any hazardous substances?

To confirm that our packaging is compliant to European Parliament and Council Directive 94/62/EC of December 20, 1994 on packaging and packaging waste, Melexis limits noxious metals and other substances in view of their environmental impact.

Melexis requires all suppliers to certify the packaging content data for the material that they or their subcontractors provide to Melexis.

For further communications

Claudia Buschendorf

Environmental Responsible

Telephone +49 361 4302 6215

Contact

Inspired Engineering

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